Solderless Breadboard, 180 Terminals, 840 Tie Points, 3 Binding Posts Allows easy and quick designing and testing of electronic circuits. Arrays of solderless sockets and bus strips emulate standard printed circuit layout practice. Universal 0.1" x 0.1" contact grid permits use of most modern active and passive components, both integrated and discrete, with lead diameters from 0.1" to 0.033" (22 AWG wires) and virtually any center spacing. Nickel-silver, spring-clip